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1. product profile 1.1 general description general-purpose zener diodes in a sod 323f (sc-90) very small and flat lead surface-mounted device (smd) plastic package. 1.2 features and benefits 1.3 applications ? general regulation functions 1.4 quick reference data [1] pulse test: t p ? 300 ? s; ?? 0.02. [2] t p =100 ? s; square wave; t j =25 ? c prior to surge 2. pinning information [1] the marking bar indicates the cathode. bzx84j series single zener diodes rev. 2 ? 1 august 2011 product data sheet sod323f ? non-repetitive peak reverse power dissipation: ? 40 w ? wide working voltage range: nominal 2.4 v to 75 v (e24 range) ? total power dissipation: ? 550 mw ? two tolerance series: ? 2%and ? 5% ? aec-q101 qualified ? low differential resistance ? small plastic package suitable for surface-mounted design table 1. quick reference data symbol parameter conditions min typ max unit v f forward voltage i f =100ma [1] --1.1v p zsm non-repetitive peak reverse power dissipation [2] --40w table 2. pinning pin description simplified outline symbol 1 cathode [1] 2 anode 2 1 006aaa152 2 1
bzx84j_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 1 august 2011 2 of 13 nxp semiconductors bzx84j series single zener diodes 3. ordering information [1] the series consists of 74 types with nominal working voltages from 2.4 v to 75 v. 4. marking table 3. ordering information type number package name description version bzx84j-b2v4 to b zx84j-c75 [1] sc-90 plastic surface-mounted package; 2 leads sod323f table 4. marking codes type number marking code type number marking code type number marking code type number marking code bzx84j-b2v4 sl bzx84j-b15 sc BZX84J-C2V4 u3 bzx84j-c15 tv bzx84j-b2v7 sm bzx84j-b16 sd bzx84j-c2v7 u4 bzx84j-c16 tw bzx84j-b3v0 st bzx84j-b18 se bzx84j-c3v0 u9 bzx84j-c18 tx bzx84j-b3v3 su bzx84j-b20 sf bzx84j-c3v3 ua bzx84j-c20 ty bzx84j-b3v6 sv bzx84j-b22 sg bzx84j-c3v6 ub bzx84j-c22 tz bzx84j-b3v9 sw bzx84j-b24 sh bzx84j-c3v9 uc bzx84j-c24 u1 bzx84j-b4v3 sz bzx84j-b27 sk bzx84j-c4v3 uf bzx84j-c27 u2 bzx84j-b4v7 ta bzx84j-b30 sn bzx84j-c4v7 ug bzx84j-c30 u5 bzx84j-b5v1 td bzx84j-b33 sp bzx84j-c5v1 ul bzx84j-c33 u6 bzx84j-b5v6 te bzx84j-b36 sr bzx84j-c5v6 um bzx84j-c36 u7 bzx84j-b6v2 th bzx84j-b39 ss bzx84j-c6v2 ur bzx84j-c39 u8 bzx84j-b6v8 tk bzx84j-b43 sx bzx84j-c6v8 us bzx84j-c43 ud bzx84j-b7v5 tm bzx84j-b47 sy bzx84j-c7v5 uu bzx84j-c47 ue bzx84j-b8v2 tn bzx84j-b51 tb bzx84j-c8v2 uv bzx84j-c51 uh bzx84j-b9v1 tp bzx84j-b56 tc bzx84j-c9v1 uw bzx84j-c56 uk bzx84j-b10 s8 bzx84j-b62 tf bzx84j-c10 tr bzx84j-c62 un bzx84j-b11 s9 bzx84j-b68 tg bzx84j-c11 ts bzx84j-c68 up bzx84j-b12 sa bzx84j-b75 tl bzx84j-c12 tt bzx84j-c75 ut bzx84j-b13 sb - - bzx84j-c13 tu - -
bzx84j_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 1 august 2011 3 of 13 nxp semiconductors bzx84j series single zener diodes 5. limiting values [1] t p =100 ? s; square wave; t j =25 ? c prior to surge [2] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 . 6. thermal characteristics [1] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 1 cm 2 . [2] soldering point of cathode tab. 7. characteristics [1] pulse test: t p ? 300 ? s; ?? 0.02. table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit i f forward current - 250 ma i zsm non-repetitive peak reverse current [1] -see ta b l e 8 and 9 p zsm non-repetitive peak reverse power dissipation [1] -40w p tot total power dissipation t amb ? 25 ?c [2] -550mw t j junction temperature - 150 ?c t amb ambient temperature ? 55 +150 ?c t stg storage temperature ? 65 +150 ?c table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] - - 230 k/w r th(j-sp) thermal resistance from junction to solder point [2] --55k/w table 7. characteristics t j =25 ? c unless otherwise specified. symbol parameter conditions min typ max unit v f forward voltage [1] i f =10ma --0.9v i f = 100 ma - - 1.1 v
bzx84j_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 1 august 2011 4 of 13 nxp semiconductors bzx84j series single zener diodes table 8. characteristics per type; bzx84j-b2v4 to bzx84j-c24 t j =25 ? c unless otherwise specified. bzx84j- xxx sel working voltage v z (v) differential resistance r dif (? ) reverse current i r (? a) temperature coefficient s z (mv/k) diode capacitance c d (pf) [1] non-repetitive peak reverse current i zsm (a) [2] i z =5ma i z =1ma i z =5ma i z =5ma min max max max max v r (v) min max max max 2v4 b 2.35 2.45 400 100 50 1 ? 3.5 0 450 12 c2.22.6 2v7 b 2.65 2.75 450 100 20 1 ? 3.5 0 440 12 c2.52.9 3v0 b 2.94 3.06 500 95 10 1 ? 3.5 0 425 12 c2.83.2 3v3 b 3.23 3.37 500 95 5 1 ? 3.5 0 410 12 c3.13.5 3v6 b 3.53 3.67 500 90 5 1 ? 3.5 0 390 12 c3.43.8 3v9 b 3.82 3.98 500 90 3 1 ? 3.5 0 370 12 c3.74.1 4v3 b 4.21 4.39 600 90 3 1 ? 3.5 0 350 12 c4 4.6 4v7 b 4.61 4.79 500 80 3 2 ? 3.5 0.2 325 12 c4.45 5v1 b 5 5.2 480 60 2 2 ? 2.7 1.2 300 12 c4.85.4 5v6 b 5.49 5.71 400 40 1 2 ? 22.5275 12 c5.26 6v2 b 6.08 6.32 150 10 3 4 0.4 3.7 250 12 c5.86.6 6v8 b 6.66 6.94 80 15 2 4 1.2 4.5 215 12 c6.47.2 7v5 b 7.35 7.65 80 10 1 5 2.5 5.3 170 4 c7 7.9 8v2 b 8.04 8.36 80 10 0.7 5 3.2 6.2 150 4 c7.78.7 9v1 b 8.92 9.28 100 10 0.5 6 3.8 7 120 3 c8.59.6 10 b 9.8 10.2 150 10 0.2 7 4.5 8 110 3 c 9.4 10.6 11 b 10.8 11.2 150 10 0.1 8 5.4 9 108 2.5 c 10.4 11.6 12 b 11.8 12.2 150 10 0.1 8 6 10 105 2.5 c 11.4 12.7
bzx84j_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 1 august 2011 5 of 13 nxp semiconductors bzx84j series single zener diodes [1] f = 1 mhz; v r =0v [2] t p = 100 ? s; square wave; t j =25 ? c prior to surge 13 b 12.7 13.3 170 10 0.1 8 7 11 103 2.5 c 12.4 14.1 15 b 14.7 15.3 200 15 0.05 10.5 9.2 13 99 2 c 13.8 15.6 16 b 15.7 16.3 200 20 0.05 11.2 10.4 14 97 1.5 c 15.3 17.1 18 b 17.6 18.4 225 20 0.05 12.6 12.4 16 93 1.5 c 16.8 19.1 20 b 19.6 20.4 225 20 0.05 14 14.4 18 88 1.5 c 18.8 21.2 22 b 21.6 22.4 250 25 0.05 15.4 16.4 20 84 1.25 c 20.8 23.3 24 b 23.5 24.5 250 30 0.05 16.8 18.4 22 80 1.25 c 22.8 25.6 table 8. characteristics per type; bzx84j-b2v4 to bzx84j-c24 ?continued t j =25 ? c unless otherwise specified. bzx84j- xxx sel working voltage v z (v) differential resistance r dif (? ) reverse current i r (? a) temperature coefficient s z (mv/k) diode capacitance c d (pf) [1] non-repetitive peak reverse current i zsm (a) [2] i z =5ma i z =1ma i z =5ma i z =5ma min max max max max v r (v) min max max max
bzx84j_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 1 august 2011 6 of 13 nxp semiconductors bzx84j series single zener diodes [1] f = 1 mhz; v r =0v [2] t p = 100 ? s; square wave; t j =25 ? c prior to surge table 9. characteristics per type; bzx84j-b27 to bzx84j-c75 t j =25 ? c unless otherwise specified. bzx84j- xxx sel working voltage v z (v) differential resistance r dif ( ? ) reverse current i r (? a) temperature coefficient s z (mv/k) diode capacitance c d (pf) [1] non-repetitive peak reverse current i zsm (a) [2] i z =2ma i z =0.5ma i z =2ma i z =2ma min max max max max v r (v) min max max max 27 b 26.5 27.5 250 40 0.05 18.9 21.4 25.3 73 1 c 25.1 28.9 30 b 29.4 30.6 250 40 0.05 21 24.4 29.4 66 1 c2832 33 b 32.3 33.7 275 40 0.05 23.1 27.4 33.4 60 0.9 c3135 36 b 35.3 36.7 300 60 0.05 25.2 30.4 37.4 59 0.8 c3438 39 b 38.2 39.8 300 75 0.05 27.3 33.4 41.2 58 0.7 c3741 43 b 42.1 43.9 325 80 0.05 30.1 37.6 46.6 56 0.6 c4046 47 b 46.1 47.9 325 90 0.05 32.9 42 51.8 55 0.5 c4450 51 b 50 52 350 110 0.05 35.7 46.6 57.2 52 0.4 c4854 56 b 54.9 57.1 375 120 0.05 39.2 52.2 63.8 49 0.3 c5260 62 b 60.8 63.2 400 140 0.05 43.4 58.8 71.6 44 0.3 c5866 68 b 66.6 69.4 400 160 0.05 47.6 65.6 79.8 40 0.25 c6472 75 b 73.5 76.5 400 175 0.05 52.5 73.4 88.6 35 0.2 c7079
bzx84j_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 1 august 2011 7 of 13 nxp semiconductors bzx84j series single zener diodes (1) t j =25 ? c (prior to surge) (2) t j = 150 ? c (prior to surge) t j =25 ? c fig 1. non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values fig 2. forward current as a function of forward voltage; typical values bzx84j-b/c2v4 to bzx84j-b/c4v7 t j =25 ? c to 150 ? c bzx84j-b/c5v1 to bzx84j-b/c15 t j =25 ? c to 150 ? c fig 3. temperature coefficient as a function of working current; typical values fig 4. temperature coefficient as a function of working current; typical values mbg801 10 3 1 t p (ms) p zsm (w) 10 10 2 10 ?1 10 1 (1) (2) v f (v) 0.6 1 0.8 mbg781 100 200 300 i f (ma) 0 i z (ma) 10 ?1 10 2 10 1 mld444 ?1 ?0.5 ?1.5 0 0.5 s z (mv/k) ?2 2v4 4v7 4v3 3v9 3v6 3v3 3v0 2v7 mld445 4 0 8 12 s z (mv/k) ?4 i z (ma) 10 ?1 10 2 10 1 15 13 12 11 10 9v1 5v6 5v1 8v2 7v5 6v8 6v2
bzx84j_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 1 august 2011 8 of 13 nxp semiconductors bzx84j series single zener diodes 8. test information 8.1 quality information this product has been qualified in accordance with the automotive electronics council (aec) standard q101 - stress test qualificat ion for discrete semiconductors , and is suitable for use in automotive applications. t j =25 ? c bzx84j-b/c2v7 to bzx84j-b/c8v2 t j =25 ? c bzx84j-b/c10 to bzx84j-b/c36 fig 5. working current as a function of working voltage; typical values fig 6. working current as a function of working voltage; typical values v z (v) 010 8 46 2 006aaa996 20 30 10 40 50 i z (ma) 0 v z(nom) (v) = 2.7 3.3 3.9 4.7 5.6 6.8 8.2 v z (v) 040 30 10 20 006aaa997 10 20 30 5 15 25 i z (ma) 0 v z(nom) (v) = 10 36 332722 18 12 15
bzx84j_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 1 august 2011 9 of 13 nxp semiconductors bzx84j series single zener diodes 9. package outline 10. packing information [1] for further information and the avai lability of packing methods, see section 14 . 11. soldering fig 7. package outline sod323f (sc-90) 04-09-13 dimensions in mm 0.80 0.65 0.25 0.10 0.5 0.3 2.7 2.3 1.8 1.6 0.40 0.25 1.35 1.15 1 2 table 10. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number package description packing quantity 3000 10000 bzx84j-b2v4 to bzx84j-c75 sod323f 4 mm pitch, 8 mm tape and reel -115 -135 reflow soldering is the only recommended soldering method. fig 8. reflow soldering footprint sod323f (sc-90) 0.95 1.65 2.2 2.1 3.05 solder lands solder resist occupied area solder paste dimensions in mm 0.5 (2) 0.6 (2) 0.6 (2) 0.5 (2) sod323f_fr
bzx84j_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 1 august 2011 10 of 13 nxp semiconductors bzx84j series single zener diodes 12. revision history table 11. revision history document id release date data sheet status change notice supersedes bzx84j_ser v.2 20110801 product data sheet - bzx84j_ser v.1 modifications: ? figure 5 and figure 6 updated ? figure 8 updated ? section 1.2 ? features and benefits ? updated ? section 5 ? limiting values ? updated ? section 8 ? test information ? added ? section 13 ? legal information ? updated bzx84j_ser v.1 20070301 product data sheet - -
bzx84j_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 1 august 2011 11 of 13 nxp semiconductors bzx84j series single zener diodes 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 13.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 13.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
bzx84j_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 1 august 2011 12 of 13 nxp semiconductors bzx84j series single zener diodes quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. 13.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors bzx84j series single zener diodes ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 1 august 2011 document identifier: bzx84j_ser please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.1 quality information . . . . . . . . . . . . . . . . . . . . . . 8 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 packing information . . . . . . . . . . . . . . . . . . . . . 9 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 11 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 13.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 14 contact information. . . . . . . . . . . . . . . . . . . . . 12 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

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